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 STP60NF03L
N-channel 30V - 0.008 - 60A TO-220 STripFETTM Power MOSFET
General features
Type STP60NF03L
VDSS 30V
RDS(on) <0.01
ID 60A
Low threshold drive
3 1 2
Description
This Power MOSFET is the latest development of STMicroelectronis unique "Single Feature SizeTM" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
TO-220
Internal schematic diagram
Applications
Switching application
Order codes
Part number STP60NF03L Marking P60NF03L Package TO-220 Packaging Tube
August 2006
Rev 4
1/12
www.st.com 12
Contents
STP60NF03L
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
3 4 5
Test circuit
................................................ 8
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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STP60NF03L
Electrical ratings
1
Electrical ratings
Table 1.
Symbol VGS VDGR VGS ID ID IDM
(1)
Absolute maximum ratings
Parameter Gate-source voltage Drain-gate Voltage (RGS = 20 k) Gate- source Voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC=100C Drain current (pulsed) Total dissipation at TC = 25C Derating factor Value 30 30 20 60 42 240 100 0.67 650 175 -65 to 175 Unit V V V A A A W W/C mJ C
PTOT
(2)
EAS
Single pulse avalanche energy Operating junction temperature Storage temperature
TJ Tstg
1. Pulse width limited by safe operating area 2. Starting Tj = 25C, ID = 30A, VDD = 20V
Table 2.
Rthj-case Rthj-a Rthc-sink Tl
Thermal data
Thermal resistance junction-case Max Thermal resistance junction-ambient Max Thermal resistance case-sink typ Maximum lead temperature for soldering purpose 1.5 62.5 0.5 300 C/W C/W C/W C
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Electrical characteristics
STP60NF03L
2
Electrical characteristics
(TCASE=25C unless otherwise specified) Table 3.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on)
On/off states
Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 250 A, VGS= 0 VDS = Max rating, VDS = Max rating @125C VGS = 20V VDS= VGS, ID = 250A VGS= 10V, ID= 30A VGS= 4.5V, ID= 30A 1 1.5 Min. 30 1 10
100
Typ.
Max.
Unit V A A nA V
2.5
0.008 0.010 0.0095 0.015
Table 4.
Symbol gfs (1) Ciss Coss Crss td(on) tr Qg Qgs Qgd
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on Delay Time Rise Time Total gate charge Gate-source charge Gate-drain charge Test conditions VDS > ID(on) x RDS(on)max, ID = 30A VDS =25V, f=1 MHz, VGS=0 VDD = 15V, ID = 30A, RG = 4.7, VGS = 4.5V (see Figure 12) VDD=24V, ID = 60A VGS =5V Min. Typ. 60 2550 630 215 40 250 43 12 21 58 Max. Unit S pF pF pF ns ns nC nC nC
1. Pulsed: pulse duration=300s, duty cycle 1.5%
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STP60NF03L
Electrical characteristics
Table 5.
Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current ISD=60A, VGS=0 ISD=60A, di/dt = 100A/s, VDD=15V, Tj=150C (see Figure 14) 75 100 2.6 Test conditions Min Typ. Max 60 240 1.5 Unit A A V ns C A
1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5%
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Electrical characteristics
STP60NF03L
2.1
Figure 1.
Electrical characteristics (curves)
Safe operating area Figure 2. Thermal impedance
Figure 3.
Output characterisics
Figure 4.
Transfer characteristics
Figure 5.
Transconductance
Figure 6.
Static drain-source on resistance
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STP60NF03L Figure 7. Gate charge vs gate-source voltage Figure 8.
Electrical characteristics Capacitance variations
Figure 9.
Normalized gate threshold voltage vs temperature
Figure 10. Normalized on resistance vs temperature
Figure 11. Source-drain diode forward characteristics
7/12
Test circuit
STP60NF03L
3
Test circuit
Figure 13. Gate charge test circuit
Figure 12. Switching times test circuit for resistive load
Figure 14. Test circuit for inductive load Figure 15. Unclamped Inductive load test switching and diode recovery times circuit
Figure 16. Unclamped inductive waveform
Figure 17. Switching time waveform
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STP60NF03L
Package mechanical data
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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Package mechanical data
STP60NF03L
TO-220 MECHANICAL DATA
DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154
oP
Q
10/12
STP60NF03L
Revision history
5
Revision history
Table 6.
Date 09-Sep-2004 09-Aug-2006
Revision history
Revision 3 4 Complete document New template, no content change Changes
11/12
STP60NF03L
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